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Stealth dicing of LED and ultrafast laser

(Summary description)

Stealth dicing of LED and ultrafast laser

(Summary description)

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Light Emitting Diode (LED) is a solid-state cold light source, which uses semiconductor as lighting material. When a forward voltage is applied on electrodes, carriers in the semiconductor material compounds, releasing energy, emitting photons, and generating visible beams. LED lamp can be with lifetime of up to 10,000 hours, and are 10 times more efficiency than incandescent lamp and twice as fluorescent lamp. It also features with anti-vibration, good safety, durable, environment friendly etc. LED is the fourth generation of new energy light source after incandescent lamp, fluorescent lamp, high intensity high pressure sodium lamp and metal halide lamp. Its unique illumination method makes it a typical green light source, and has been widely used in backlight lighting, road traffic, transportation and display such applications.

 

With development of LED chip technology, expanding market shares and involving requirements, LED dicing technology is constantly improving. In early days, diamond scribing was mainly used for dicing of nonmetal substrate materials (mainly sapphire) in LED production process. Since sapphire material is too hard to process, it caused great consumption of diamond during processing, besides that a certain degree of physical deformation such as micro cracks exist and affect final performance of the LED device. A second generation of LED dicing technology is using diamond wheel with blade saws, which embeds ti